SPIROX

Spirox will host the Advanced Packaging Technology Forum: Glass Core and TGV for Next-Generation AI and HPC on September 8, 2026, at the Sheraton Hsinchu Hotel. The forum will feature distinguished speakers from Corning and Dai Nippon Printing (DNP), who will share the latest developments in Glass Core materials, the challenges of high-speed signal transmission and package reliability, failure mechanisms in large-scale AI server packages, and the latest inspection and analytical technologies.

Amid the growing global momentum toward sustainability, Spirox is actively advancing a comprehensive ESG governance framework. To enhance information transparency and fulfill its responsibilities as a responsible corporate citizen, Spirox today officially launched the ESG section on its corporate website.

Spirox (TWSE: 3055), a leading semiconductor equipment provider, announced another breakthrough with its industry-first patented Spirox Laser Tomography Scan (SpiroxLTS®) technology. Spirox has introduced a dual-optical-path module for its SP8000S non-destructive TSV inspection system, enabling high precision measurement of individual TSV depth, sidewall defects, and bottomresidues. This advancement helps customers overcome long-standing process bottlenecks by these measurements. Spirox confirmed that the SP8000S system has passed customer qualification and received a confirmed purchase order, with shipments scheduled for next year and expected to contribute directly to revenue and profitability.