PRODUCTS
PRODUCTS
Spirox Laser Tomography Scan System
Semiconductor IC Testing Equipment
Semiconductor Packaging Equipment
Lab Wafer and Chip Inspection Equipment
Mass Production Chip Inspection Equipment
ATE/Prober Board Repair Service
Accessories
Spirox Laser Tomography Scan System
COMPETENCE
WHY SPIROX
Spirox (TWSE: 3055) is a leading professional brand in the global semiconductor equipment industry. We offer advanced, comprehensive products and services to meet the needs of semiconductor manufacturing processes and diverse products, including equipment for testing, packaging, inspection, and verification, along with application engineering and customer support.
Extensive Industry Experience
Innovative R&D Capabilities
Global
Partners
Strong Financial Stability
11
/ Nov / 2026
Events
Spirox will host the Glass Substrate Microcrack Inspection Technology Forum & Live Demo on December 18, 2026. Centered on its proprietary patented SpiroxLTS® Laser Tomography Scan technology, the forum will explore inspection requirements across key glass substrate processes, including metallization, build-up, and singulation.
NEWS
LATEST NEWS
08
/ Sep / 2026
Latest News
Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection
Advanced Packaging Technology Forum Brings Together Corning and DNP to Highlight Key Technologies for TGV Advanced Packaging
Spirox Corporation (TWSE: 3055), a leading semiconductor equipment provider, today hosted the Advanced Packaging Technology Forum – Development and Challenges of Glass Core and TGV for Next-Generation AI and HPC, bringing together experts from Corning and Dai Nippon Printing (DNP) to share the latest developments in Glass Core materials, TGV processes, packaging reliability, and inspection technologies. At the forum, Spirox also unveiled its new SP7000G High-Speed TGV Crack Inspection System, demonstrating its capabilities in advancing inspection solutions for the high-volume manufacturing of Glass Core and TGV.
01
/ Jul / 2026
Events
Registration Now Open | Spirox Advanced Packaging Technology Forum: Glass Core and TGV for Next-Generation AI and HPC
Spirox will host the Advanced Packaging Technology Forum: Glass Core and TGV for Next-Generation AI and HPC on September 8, 2026, at the Sheraton Hsinchu Hotel. The forum will feature distinguished speakers from Corning and Dai Nippon Printing (DNP), who will share the latest developments in Glass Core materials, the challenges of high-speed signal transmission and package reliability, failure mechanisms in large-scale AI server packages, and the latest inspection and analytical technologies.
05
/ Jan / 2026
Latest News
Spirox Launches ESG Section on Its Official Website to Strengthen Sustainable Governance
Amid the growing global momentum toward sustainability, Spirox is actively advancing a comprehensive ESG governance framework. To enhance information transparency and fulfill its responsibilities as a responsible corporate citizen, Spirox today officially launched the ESG section on its corporate website.
