Non-Destructive Laser Modification Inspection System
Tomogram of Laser Modification for Superior Pre-Etching Quality Assessment & Precision Control for Success!
PRODUCT DESCRIPTION
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Exclusive Patented SpiroxLTS Technology!
Advanced optical measurement with SpiroxLTS Technology for the improvement of the laser modification to best match the glass processing. -
No Destruction on Sample!
Non-destructive inspection with SpiroxLTS enables precise control of laser modification performance, significantly reducing process costs and optimizing production conditions! -
Precise critical via dimension measurements
Ultimate optimization tool for the TGV process, ensuring unparalleled manufacturing precision!
FEATURES
Comprehensive inspection of laser modification continuity and uniformity, ensuring that laser modification quality meets process design requirements!
ADVANTAGES
Industry-First Direct Identification
The only technology for inspecting laser modification continuity and uniformity, providing early prediction of etched perforation outcomes after laser modification.
Process Parameter Optimization & Calibration
Tomogram of laser modification enables rapid adjustment of laser parameters and optimization of optical path design, significantly saving process development time.
TGV Profile Inspection
Offering a more efficient, direct, and concrete inspection method compared to time-consuming SEM, higher visibility than conventional optical microscopy, and superior to restricted-range surface profilometry.
Precise Measurement of TGV Size & Inspection of Structural Defects
TGV through-hole vertical axis deviation, critical dimensions.
Laser Modification Impact on Post-Etching TGV
FUNCTION DESCRIPTION
Significantly shortens development time and effectively reduces R&D costs. Precisely select laser source and glass material to ensure that TGV laser modification and through-hole etching meet manufacturing quality specifications.
Monitor laser modification quality before etching, providing real-time prediction on whether etching is necessary, avoiding blind etching from past practices and preventing unnecessary cost waste.
Monitor TGV through-hole quality, reduce product defects, increase output, and prevent the batch costs associated with ineffective yield.
3D Tomogram : Continuity and Uniformity of Laser Modification
Dynamic Tomogram of Laser Modification
(Laser modification changes along the vertical depth)
PRODUCT SPECIFICATIONS
| Item | Content |
|---|---|
| Model Number | SP8000G |
| Model Name | SP8000G Non-Destructive Laser Modification Inspection System |
| Key Optical Technology | Nonlinear Optical Inspection (Application wavelength 1200~1800 nm) |
| Applicable Sample Size |
Standard: 300 mm x 300 mm Extended: 510 mm x 515 mm |
| Sample Thickness | Maximum thickness*: 1200µm |
| Measurement Items | Laser Tomography Scan, 3D Imaging, and Dynamic Tomogram; TGV Aperture Size and Roundness Measurement, Waist Depth Positioning, 3D Profile Image, and Cross Section Analysis |
| FOV / Measurement Time | FOV 400µm x 400µm**；3.5 seconds / frame*** |
| Measurement Accuracy |
X, Y axis precision < 1.5µm, Z axis precision < 2µm (@ 20x objective, numerical aperture 0.8) |
| Inspection Modes | Micro-area imaging, sub-region automatic measurement, coordinate-based automatic measurement, random automatic measurement, script scanning process. |
|
Dimensions and Weight (Tentative) |
Standard: L2.4 m x W1.8 m x H1.8 m (Weight: 2600 kg) Extended: L2.6 m x W2.0 m x H1.8 m (Weight: 3200 kg) |
| Electrical Specification |
220V 60Hz AC 1500W |
