Semiconductor Test System

Optimized for throughput and cost, STS is a production-ready ATE solution for RF, mixed-signal, and MEMS semiconductor devices. STS is ready for the production test cell, with support for manipulators, handlers, and wafer probers, and a standard spring pin layout enables highly transferable test programs and load boards.
PRODUCT DESCRIPTION

PRODUCT DESCRIPTION

NI has developed the STS, a test system designed for rapid deployment in production environments for semiconductor component testing. NI excels in RF technology (e.g., PA, FEM, Tuner, WiFi, BT, and high-power (>40W) RF signal sources). Additionally, the open and modular design of the PXI platform offers enhanced computational power and a rich array of instrument resources, further boosting semiconductor test efficiency and reducing testing costs.
 
FEATURES

FEATURES

Powerful Software Tools: Test Program Development, Adjustment, and Deployment
NI STS software provides the tools needed to develop, adjust, optimize, maintain, and deploy multi-site test programs. With add-on modules for the TestStand environment, engineers can achieve a superior user experience for test program development and debugging.
Suitable for Mainstream Semiconductor Manufacturing Environments
NI STS is suitable for mainstream semiconductor manufacturing environments and can be easily integrated into production test equipment:
  • Handler/Prober integration and standard docking (including Soft Dock/Hard Dock)
  • Pogo Pin connections
  • STDF data report generation and system calibration
Intelligent Semiconductor Test System
NI STS combines the NI PXI platform with modular instrumentation, system design software, and further leverages big data analysis to create a test system ready for RF and mixed-signal production test. NI STS can achieve high-throughput test optimization, accelerate the semiconductor product lifecycle, and help customers reduce time-to-market and overall costs.
FUNCTION DESCRIPTION

FUNCTION DESCRIPTION

Application Test Challenges NI STS Solution

RFIC

The trend in RF front-end module development is to integrate more modules (such as power amplifiers, low-noise amplifiers (LNA), duplexers, and antenna switches) into a single component.
 
The integration design of multi-mode, multi-band RF front-end increases the complexity of testing.
  • Providing leading RFIC testing solutions from RF front-end module testing, discrete RF components, RF transceivers to RF MCUs.
  • Through modular platform design, significantly reducing testing time and costs.

5G RFIC

The 5G wireless communication standard defined by 3GPP:
  • enhanced Mobile Broadband (eMBB): Achieve a peak throughput of 10 Gbps or more.
  • ultra reliable and Low Latency Communications (uRLLC): Delay less than 1ms.
  • massive Machine Type Communications (mMTC): Support connection densities of up to 1M/km2
  • NI has been engaged in research and development since the 5G prototype stage, using its open platform of software-defined radio to conduct research on various applications of 5G, such as antenna technology, millimeter-wave frequencies, and New Radio.
  • A software-centric modular instrument can fully meet the test requirements for 5G RFICs.
PMIC As chip integration increases, the structure of power management chips evolves not only towards single-topology designs such as Buck circuits but also towards high integration with multiple analog output channels and digital chip control, requiring higher density and precision in integrated analog/digital testing systems.
  • Achieve verification analysis and production testing of efficiency, line/load regulation, transient response, etc., through high-precision, high-density power measurement units, oscilloscopes, and digital waveform generators. And use modular instrument architecture to significantly enhance test speed and reduce costs.
MEMS Reduce the test time, system volume, and overall costs required for MEMS, while simultaneously ensuring test quality.
  • Test applications include MEMS accelerometers, gyroscopes, and microphones.
  • Modular platform can significantly reduce test time and costs, while also integrating with MEMS test handlers.

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