Plasma Cleaner - Prosumer Virgo Series
Designed for cleaning and modifying microelectronic surfaces, Boffotto’s plasma cleaning equipment enhances wire bonding and chip bonding, addressing deficiencies in the flip-chip packaging process. It is suitable for processing various electronic materials, including plastics, metals, and glass.
ADVANTAGES
ADVANTAGES
Provides online plasma solutions suitable for highly automated production lines
13.56MHz RF power source with automatic impedance matcher
Special stainless steel cavity and electrodes, with dust free generation during the production process
FUNCTION DESCRIPTION
FUNCTION DESCRIPTION
【Applications】
Removing organic pollutants
Removing fluorine and other halogen pollution
Removing metals and metal oxides
Improving the adhesive force of spin-coated films
Cleaning metal bonding pads
Cleaning up contamination before wafer bumping
