Plasma Cleaner - M03Q Series
Designed for cleaning and modifying microelectronic surfaces, Boffotto’s plasma cleaning equipment enhances wire bonding and chip bonding, addressing deficiencies in the flip-chip packaging process. It is suitable for processing various electronic materials, including plastics, metals, and glass.
ADVANTAGES
ADVANTAGES
Software monitoring of production processes
Product placement fixtures are flexible and versatile, adaptable to products of various shapes
Special stainless steel chamber and electrodes, with dust free generation during the production process
Extremely small footprint
FUNCTION DESCRIPTION
FUNCTION DESCRIPTION
【Applications】
Removing organic pollutants
Removing fluorine and other halogen pollution
Removing metals and metal oxides
Improving the adhesive force of spin-coated films
Cleaning metal bonding pads
Cleaning up contamination before wafer bumping
