Utilize a Line Scan Camera with wide FOV and fast scanning capabilities
Use a 3x lens to enhance image quality and improve the defect characteristics inspection
5μm Defects Inspection Items: Particles, Scratches, Pad Defects, Bump Defects
Support Probe Mark Inspection (PMI) and offer PAD quick selection for detection settings
Support 3D inspection to measurement of Bump height and coplanarity
Auto wafer-level chuck with ±1.7μm accuracy to process high accuracy wafer coordinate alignment
Zoning parameter setting to realize accurate inspection requirement by zones