Known Good Dies Test Handler
Capable of handling and testing semiconductor devices after wafer dicing with a throughput, OSAI NeoKGD is the best to the growing scalability needs of high-volume production in the semiconductor world.
PRODUCT DESCRIPTION
PRODUCT DESCRIPTION
NeoKGD is a standard platform designed to accommodate the customer’s KGD handling and testing needs through a wide matrix of available options. From test requirements (environment, temperature, static and dynamic tests) to the probing technology (probecards) passing through the selection of its output and rejects segregation medias.
FEATURES
FEATURES
Throughput of up to 1,800UPH
Equipped for high-speed optical inspection, the system automates handling of diced wafers, conducts precise die probing, and performs final tests at variable temperatures (hot or ambient)
Compact footprint, maximizing factory space utilization
PRODUCT SPECIFICATIONS
PRODUCT SPECIFICATIONS
| NeoKGD | ||
|---|---|---|
| Input Media | 6”, 8” or 12” Wafer Frame | |
| Output Media |
Reconstructed Wafer Frame 2”, 4” Waffle and Gel Pack Tape & Reel Jedec or Custom Tray form |
|
| Reject Media |
Bin Boxes 2”, 4” Waffle and Gel Pack |
|
Supported Tests |
AC, DC, Hi-Pot Test | |
| Temperature Control |
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| Optical Inspection | 5s, 6s, Hi-Speed Capabilities | |
| Probe Card Features |
Automatic Alignment (Probe Needles and Die) Automatic Cleaning Embedded Locking System with ATE Direct Docking Capability |
|
| Factory Integration |
SECS/GEM Interface Wafer Map Management (according to the SEMI standards) Lights-off concept ready (Robotization, AGVs) |
|
| Equipment KPIs |
Compact footprint Overall Equipment Efficiency (OEE): ≥ 92% Mean time between failures (MTBF): ≥ 1,680 hours Jam rate: ≤ 1:10k Conversion time between product/packages ≤ 15 mins Mean time to assist (MTTA) in Production Mode: less than 3 minutes for hard jam only |
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