Fluxless Reflow System
STI SRS30V is the equipment for forming bumps and flip chips using heat in semiconductor packaging processes.
FEATURES
FEATURES
Void-free bump ball performance
Various temperature profile (step & slope type)
Outstanding O2 density control (<1ppm) at every process
Conduction & convection heating chamber system
No chip sliding on the flip chip process
Temp control: 250±1% (Max.450℃) real time monitoring of process wafer temp
Process gas: formic acid or no reactant gas
Process pressure: vaccum / ATM process
EFEM(2 or 3 Port): SEMI standards
ADVANTAGES
ADVANTAGES
Reduce nitrogen usage costs
Eliminates solder ball reoxidation
Resolves internal voids and solder splashing issues in solder balls
Reduce particle generation and extend maintenance cycle
High yield and high throughput
FUNCTION DESCRIPTION
FUNCTION DESCRIPTION
【Application】
Fluxless reflow for solder bump ball, Cu pillar & CoW chip bonding of the HBM
Vacuum or ATM reflow system
