Automatic Wire Bonding Measurement Instrument
YCT WM-5200 is a high-accuracy measurement instrument developed for wire bonding processes, such as ball height, ball thickness, loop height, etc. It also has die bonding measurement functions as an option, such as die tilt and rotation.
ADVANTAGES
ADVANTAGES
Automatic measurement avoids human errors
Unified measurement definitions and specifications
Convenient to execute program downloads, data uploads, and tracking
High repeatability and precision
Manpower saving
Reports formats can be self-defined
Auto Load/Unload as an option
FUNCTION DESCRIPTION
FUNCTION DESCRIPTION
【Optional】
SECS Function
Load / Unload Function
2D Reader
Die Bond Measurement
PRODUCT SPECIFICATIONS
PRODUCT SPECIFICATIONS
| WM-5200 | ||
|---|---|---|
| X/Y/Z Travelling | X Axis | 350mm |
| Y Axis | 300mm | |
| Z Axis | 150mm | |
| Total stage | 570X470mm2 | |
| Motion Control System | Indenpent Servo Motor | |
| X/Y/Z Resolution | X/Y = 0.5μm, Z = 0.1μm | |
| X/Y Axis Tolerance | ≦（2+L/100) | |
| Vision System | Camera CCD | Color 1/2" CCD |
| Object Length | High Resolution Object Lens | |
| OBLM | 5X, 20X, 50X | |
| Digital M | 136X - 1367X | |
| Software | QC3000 | |
| Lighting | LED | |
| Dimensions (mm) | 1200X1300X1820 (without indicator light) | |
| Weight | 750kg - 900kg | |
| Voltage | 220V (Single) | |
