Automatic Warpage Adjustment
**ERS product distribution rights are limited to China.**
PRODUCT DESCRIPTION
ERS WAT330 is able to process up to four FOUPs in a fully-automatic operation. It is equipped with a Wafer-ID reader and an automatic warpage measurement station that enables a high flexibility with 3 separate operation modes. It can be used strictly as a warpage measurement station, as a warpage adjustment station, or as a warpage measure/adjust/monitor station.
The upgraded WAT330 comes with a HEPA filter system for cleanroom class 100. It is also fully compliant with the GEM300 SEMI standards and compatible with automated product loading and unloading. Another upgrade is the machine’s Nitrogen environment, which can reach down to 0.5% O2 level to avoid Cu oxidation. The new WAT330 also features strong vacuum thermal chucks for no-fail wafer handling.
FUNCTION DESCRIPTION
| Facility Item | Specification |
|---|---|
| Voltage | 400 VAC 3-phase 32A |
| Frequency | 50/60 Hz |
| Power | 18 kW |
| CDA Pressure | 6 bar at 0°C dew point |
| CDA Flow Rate | 1000 l/min peak |
| Vacuum Pressure | 100 mbar |
| Vacuum Flow Rate | 100 l/min |
PRODUCT SPECIFICATIONS
| WAT Specification | |
|---|---|
| Wafer Size | 200 mm or 300/330 mm |
| Handling System | One 4-Axis Robot; special end-effector |
| Maximum Input Warpage | ± 7 mm |
| Warpage Adjust Method | ERS TriTemp Slide |
| Typical Output Warpage | < 500 µm |
| Temperature Control | DC PID and ERS AirCool® components |
| Temperature Range | -10°C up to +260°C (depending on station) |
| Oxygen Free Environment | Optional |
| W x D x H | 2273 x 1134 x 1741 mm |
| Weight | 1800 kg |
