PARTNERS

3S provides intelligent automatic assembly machine systems, focusing on the packaging technology of discrete power semiconductors, supported by solutions and services. The system of 3S includes die attach machines, stencil printers, copper strip die bonders, vacuum reflow ovens and formic acid vacuum reflow ovens. These are suitable for packaging diodes, power MOSFETs, IGBTs, power GaN, SiC, IPMs, and more.

AEM stands as a global leader in test innovation, delivering the most comprehensive semiconductor and electronics test solutions driven by the best-in-class technologies, processes, and customer support. AEM's R&D centers and manufacturing facilities are spread worldwide, dedicated to advancing internal engineering capabilities and driving solutions for the next generation of semiconductor testing needs. Additionally, AEM offers a robust and reliable ecosystem of test innovation and comprehensive support through its global network of engineering support, sales offices, partners, and distributors.

ALES TECH was founded in 2019, dedicated to enhancing the performance of ion sources and developing related patented technologies. Simultaneously, ALES TECH has developed various techniques for modulating the morphology of metal tips.

Leveraging these technologies, ALES TECH has created products such as nanoprobes, microprobes, and scanning tunneling microscope (STM) probes. Among these, the nano probing measurement system, designed for advanced semiconductor process electrical measurements, requires nanoscale metal tips for contact measurement of samples. ALES TECH provides the industry with the highest specification nanoprobes.

Boffotto (Hong Kong) Limited was established in 1993. It is a global leading company in ion etching and plasma cleaning solutions, utilizing technology developed over 30 years in the United States. As a professional supplier of plasma systems, Boffotto has been providing plasma processing solutions to customers in the high-tech electronics industry, including PCBs, LEDs, semiconductors, optoelectronics, and solar energy.

CASTEC was founded in March 2005, specialized in equipment manufacturing and committed to the development, design and manufacture of automation equipment. CASTEC has an excellent team of R&D engineers. The product applications cover traditional manufacturing, hospitals, semiconductor, footwear and bio-technology. CASTEC products are customized according to customers' requirement, regardless of design, planning or system integration, to maximize both the output and yield.

Shanghai Dongxu International Trading Co., Ltd. was established in 2008 as a professional semiconductor consumables supplier, offering semiconductor-specific tapes, various types of wafers, and semiconductor equipment, which widely applied in various areas of semiconductor packaging.

ERS electronic GmbH, based in Munich, has been producing innovative thermal test solutions for the semiconductor industry for over 50 years. The thermal chuck systems developed by ERS, including the AC3, AirCool©, AirCool© Plus, and PowerSense© product families, are integral components in large-sized wafer probers across the semiconductor industry. ERS also developed eWLB series for warpage adjustment and has kept making technology progress and improvements over a decade.

Founded in 1953, Hamamatsu Photonics K.K. is the pioneer of science and technology, coupled with the massive market share of optics science and EFA market. Hamamatsu Group's products are widely used in medical biology, high-energy physics, space exploration, precision analysis and other industries, is the optical industry leader. HAMAMATSU, with largest customer base in semiconductor and display industry, provides leading EFA solutions, OBIRCH emission microscope with high resolution location detection devices, and other professional optical products with technology patents. HAMAMATSU products are equipped with thermal, EMMI, OBIRCH functions.

HANWA, established in 1966 and headquartered in Japan, is the largest ESD testing equipment supplier in Japan. HANWA offers total solutions for IC design, manufacturing, and final product reliability testing. HANWA provides static discharge testing equipment such as ESD, TLP, CDM, Latch-up, and is the only equipment supplier with both Wafer Level and Package Level ESD Testers. HANWA’s products cover various application areas for Design House, Fab, and OSAT, and can offer customized solutions based on customer requirements.

Founded in 1976, NI is a global leader in automated test and measurement systems and has a presence in over 50 countries and serves more than 35,000 customers worldwide. In 2023, NI became a new Test & Measurement business group of Emerson. NI proactively participates in the development and research of 5G technology and collaborates with key industry players to provide testing solutions for 5G application products.

Founded in 1991, OSAI is dedicated to the field of the automation for industrial processes. OSAI offers solutions for standard systems or on special equipment used in the assembly and testing of high-tech components in the semiconductor industry, the automotive industry, electronics manufacturing and medical devices industry. Headquartered in Italy, OSAI has service locations in the United States, Germany, and China, and over 40 business partners, ensuring fast and efficient global support to provide customers with real-time service.

SEMICS Inc., a semiconductor probe equipment manufacturer in Korea, founded in 2000. OPUS3 SP/HD, one of the most competitive probers in the semiconductor industry, supports not only standard 6”, 8” and 12” wafer production and testing, and is also adaptable for smaller layout platforms. To support a wider range of equipment, OPUS3 offers faster index time and multiple temperature options to meet customer requirements. The SEMICS OPUS series is a crucial solution for semiconductor wafer-level testing, offering diverse and specialized functionalities to fulfill customer needs and provide higher value services for their products.

ShibaSoku has launched unique products from audio measurement, TV measuring instruments, communications analyzer and semiconductor test systems since established in 1955. With 50-years experience of developing semiconductor testing equipment, ShibaSoku is now focus on high power devices testing in recent years, and working closely with Japan automobile and electric appliance manufacturers to build its core value and competitiveness on power device testing.

STI was established in 1997, headquartered in South Korea. STI specializes in providing equipment for the semiconductor and display industries, including centralized chemical supply systems, wet process equipment, OLED inkjet printers, FOUP cleaning machines, vacuum reflow equipment for wafer level package and Panel level package. With extensive industry experience, STI's products are highly trusted by customers across Taiwan, China, Korea, Japan, Southeast Asia, and other European and American clients.

TESCAN is a multinational company specializing in scientific instruments for the microscopic analysis of morphology, structure, and composition. It is a globally renowned manufacturer of electron microscopy instruments, headquartered in Brno, Czech Republic, the world's largest electron microscope manufacturing hub. TESCAN's main products include electron microscopes, focused ion beams, X-ray micro-CT, integrated systems combining electron microscopy and Raman spectroscopy, dual-beam electron microscopes, secondary ion mass spectrometry systems, and related analytical accessories and software. These products are widely used in materials science, life sciences, geosciences, semiconductors, and electronic devices.

Toray Engineering Co.,Ltd. is a comprehensive engineering and automation equipment manufacturer headquartered in Japan, offering automated production inspection equipment for flat panel displays and semiconductor manufacturing, as well as various testing and monitoring instruments for the manufacturing industry. Toray Engineering offers highly precise TCB (Thermo-Compression Bonding) and FC (Flip Chip) equipment, which are used for high-precision die bonding in chip-to-wafer/substrate processes. Toray Engineering provides various equipment options to meet different customer applications and precision rate requirements.

The corporate philosophy of the Toray Group is contributing to society through the creation of new values. TASMIT, a member of Toray Engineering Group, executes this corporate philosophy with the aim of becoming a company that is highly valued by all of its stakeholders including customers, shareholders and employees. To do this, TASMIT will contribute to solving social issues through its business and implement the idea of Creating Shared Value (CSV), which combines social values with corporate values. TASMIT promises to provide effective solutions for the semiconductor device manufacturing with our two core technologies: optical wafer inspection "INSPECTRA®" and electron wafer pattern inspection "NGR".

Turbodynamics, established in 2006 and headquartered in Germany, specializes in creating connections between automatic test equipment and its interfaces in the semiconductor industry. The Turbodynamics team possesses extensive professional experience and creativity, combined with state-of-the-art testing equipment and R&D tools.

Turbodynamics can develop customized solutions based on customer needs, achieving the best long-term return on investment for semiconductor automated test equipment.

Founded in 2016, YourChance Technology is a world-leading engineering and scientific technology company with expertise in precision measurement. The main business scope is IC (integrated circuit) assembly, LED and related. YourChance is also a professional manufacturer of image measuring instruments, testing instruments, and optical rulers.