Spirox and TESCAN Jointly Showcase Innovative Chip Process Quality Solution at SEMICON China 2023
Professional semiconductor solution provider Spirox Corporation (TWSE: 3055) will participate in SEMICON China 2023 from June 29 to July 1. This year, Spirox will present the theme "Collaborative Innovation in Semiconductor, Creating a Win-Win-Win" at the Shanghai New International Expo Center, Hall E7 (Booth No.: E7223). In addition to showcasing advanced packaging, testing, and third-generation semiconductor testing and analysis solutions spanning the entire semiconductor front and back-end processes, Spirox will also collaborate with our partner, the globally renowned electronic microscopy instrument manufacturer TESCAN from the Czech Republic, to exhibit the latest FIB-SEM and STEM technologies and semiconductor solutions at the venue.
Charles Lin, General Manager of Spirox Technology (Shanghai), stated, "Recently, the semiconductor industry has been facing uncertainties such as inflation and sluggish terminal demand. Faced with industry downturns, Spirox has always adhered to a customer-oriented approach. To meet the diverse applications and rapid development of the industry, we actively form alliances with major global equipment suppliers. With advanced equipment and technological solutions, we support customers in overcoming challenges in chip production. We believe that our joint presence with TESCAN at SEMICON China will not only deepen our collaboration but also showcase our product strength and advantages to customers, advancing towards a successful future of mutual benefit with our customers."
TESCAN is the world's first manufacturer to integrate plasma FIB into scanning electron microscopy (SEM). At SEMICON China 2023, TESCAN will simulate laboratory scenes and demonstrate capabilities in sample preparation, inspection, and failure analysis through application case studies and demonstrations of failure analysis tools. This includes abilities such as deep cross-sectioning for failure analysis at the packaging level and achieving the highest resolution terminal thinning, high-quality planar layer-by-layer delayering of semiconductor devices, high-quality TEM (Transmission Electron Microscopy) thin film sample preparation, as well as capabilities in sample preparation and analysis ranging from nanometer to millimeter scales. These capabilities cater to the demands in failure analysis of integrated circuits, circuit repair, ball grid arrays, silicon vias, wire bonding, display panels, and other process technologies.
Spirox and TESCAN showcase FIB-SEM semiconductor solutions at SEMICON China 2023.
Feng Jun, General Managerof TESCAN China and Klima, Founder of TESCAN, together in front of the new TENSOR model.
In this exhibition, TESCAN not only showcases its scanning electron microscope for the first time but also presents the TESCAN Tensor model, which features excellent 4D-STEM performance, based on a 1:1 real-size replica for the first time. This allows visitors to gain a closer understanding of TESCAN's advanced technology and capabilities in scanning transmission electron microscopy. Spirox will highlight three major aspects: advanced packaging, third-generation semiconductor processes, and chip process quality assurance. Spirox will introduce high-quality solutions such as Toray Engineering's advanced wafer bonding technology, Southport's third-generation semiconductor non-destructive 3D material defect inspection and 3D stress inspection analysis services, and Hamamatsu's electrical failure analysis applications. From June 29 to July 1, feel free to visit Spirox at booth Booth E7223 in Hall E7 and meet with our experts about your application scenarios, problems, and needs.
